The system also offers sockets with or without the float feature. In addition to this unique float design providing 1.00mm of axial float, the Coeur CST High-Current Interconnect System is also compact in size allowing for a mated board-to-board profile as low as 5.00mm that doesn’t require a large protrusion above or below the mated boards. “This makes Coeur CST ideal for applications where the need for float is critical for Power Distribution mechanical packaging.” In the Coeur CST High-Current Interconnect System, our design allows for the entire core socket assembly to move within an outer housing, preventing potential overstress damage to the contacts,” said Jeff Gaumer, global product manager, Molex. “It is difficult to have perfect pin-to-socket alignment when mating two rigid PCBs or bus bars. LISLE, IL – August 21, 2018 – Molex offers the innovative Coeur CST High-Current Interconnect System featuring a unique new float design that accommodates pin to socket misalignment allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without the risk of overstress damage to the socket contact system.
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